Basic information
SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS) Structure

SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS)

Preparation Products And Raw materials