Basic information Price
SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS) Structure

SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS)

SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS) Price

Preparation Products And Raw materials